C7035 ultra-thin strip at 0.05mm for AI connector contacts and iPhone USB-C components. YCuT-FX copper-titanium for semiconductor test sockets. AD-442 for Nvidia AI memory module leads. Serving Foxconn, Luxshare, JAE and Amphenol manufacturing plants in China and Vietnam.
C7035超薄带材(0.05mm)用于AI连接器和iPhone USB-C部件。YCuT-FX铜钛合金用于半导体测试插座。AD-442用于英伟达AI内存模组引线。服务富士康、立讯精密、JAE等在华越南工厂。
Where every micron and every milliohm of contact resistance matters. 每一微米、每一毫欧的接触电阻都至关重要的应用场景。
All alloys supplied with certificate of analysis (CoA), chemical composition certificate and dimensional inspection report. 所有合金附成分证书、化学分析报告及尺寸检验报告。
| Grade | Name | Key Properties | Min Thickness | Tensile MPa | Primary Use | Stock | |
|---|---|---|---|---|---|---|---|
| C7035 CuNi3Si1Mg · Dowa TC | Corson Ultra-Thin | 0.05mmHigh strength45% IACS | 0.05mm | 600–750 | AI connectors · iPhone · Memory leads | ● In Stock | |
| YCuT-FX CuTi · Dowa proprietary | Copper-Titanium | Ultra-high strengthHigh tempUnique process | 0.08mm | 900–1,100 | Test sockets · High-temp connectors | ○ On Order | |
| AD-442 Dowa proprietary Corson | Nvidia AI Memory Grade | AI optimisedUltra-thinHigh density | 0.06mm | 550–700 | Nvidia HBM leads · GPU socket pins | ○ On Order | |
| C7025 CuNi2SiMg | Corson Standard | Good strengthHigh conductivityCost effective | 0.08mm | 500–620 | RF connectors · 5G components · SIM springs | ● In Stock | |
| C19400 CuFe2P | Iron Copper | 65% IACSHeat resistantCost effective | 0.10mm | 380–480 | Lead frames · Automotive relays | ● In Stock |
Tell us your thickness, width, quantity and delivery destination. We respond within 24 hours. 请告知厚度、宽度、数量及交货地,24小时内回复。